Liu made a presentation at COOL Chips 24

Hello, this is Liu from Takizawa Lab.

2021 IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 24) was held during April 14-16.

Because of the COVID-19, the COOL Chips 24 was held as a virtual conference.

I made a presentation in the Poster Session. Here are the details of the poster.

• Jiaheng Liu, Ryusuke Egawa, Mulya Agung, and Hiroyuki Takizawa. “A Conflict-Aware Capacity Control Mechanism for Deep Cache Hierarchy.” 2021 IEEE Symposium on Low-Power and High-Speed Chips and Systems (COOL Chips 24). [Program]